Abstract: The photovoltaic industry requires the cutting of Silicon ingots into wafers to facilitate the manufacturing of silicon with view to achieve higher productivity.. In this study the wire electric discharge machining process(WEDM) was selected for machining of Polycrystalline silicon to study the effect of various input parameters like Pulse ON time, Pulse OFF time, peak current, wire feed, wire tension, spark gap voltage and water pressure on cutting rate, surface finish and kerf width. The experimental results showed that pulse on time, pulse off time, spark gap voltage, wire feed and water pressure have significant effect on cutting rate, surface finish and kerf width. The other machining parameters like wire tension and peak current did not have large effect on machining process. The experiments performed demonstrated that WEDM process can be applied to produce silicon wafers from polycrystalline silicon ingots. Hence the application of WEDM process to the manufacture of solar cells can bring significant enhancement in production efficiency of solar cells.
Keywords: photovoltaic industry, WEDM, silicon, solar cells.
Title: Analysis of Wire EDM machining parameters on machining of Silicon material
Author: Raminder Singh, Anish Kumar
International Journal of Mechanical and Industrial Technology
ISSN 2348-7593 (Online)
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