Abstract: The present study explored the synergistic effects of alloying elements and solid solution treatment on the impact energy, density, and conductivity of Cu-3Si-(Zn, Sn) alloys system. Response surface optimal design (RSOD) was utilized to design the alloys compositions. The Cu-3Si-3(Zn, Sn) alloys samples were cast employing stir-casting technique and machined to the required dimensions for the properties tests. The cast samples underwent solid solution at temperature of 900oC for 5 h. The microstructures of the cast samples were analyzed using optical metallurgical microscope (OM). The OM results revealed increased solid solution of zinc in the copper matrix after solid solution heat treatment. Conversely, tin showed increased segregation (coarse grains) in the copper matrix after heat treatment. This led to increase in electrical conductivity of Cu-3Si-3(Sn) ternary alloy in heat treated condition, unlike in Cu-3Si-3(Zn) where a decrease in electrical conductivity is obtained. Both Cu-3Si-3(Zn) and Cu-3Si-3(Sn) ternary alloys recorded increase in impact energy compared with the parent alloy (Cu-3Si). The impact energy of Cu-3Si-3(Sn) ternary alloy recorded a slight increase from 25.2 J to 25.9 J after heat treatment. Cu-3Si-3(Sn) ternary alloy also recorded a slight decrease in density compared with the as-cast Cu-3Si-3(Sn) and parent alloys. Solid solution heat treatment had no positive effect of the impact energy and electrical conductivity of Cu-3Si-3(Zn) ternary alloy.
Keywords: Cu-3Si-3Zn; Cu-3Si-3Sn; grainsmorphology; strength; hardness.
Title: Synergistic effects of alloying elements and solid solution treatment on the impact energy, density and conductivity of Cu-3Si-3(Zn, Sn) alloys system
Author: Agatha Ifeoma ijomah, Kingsley Chidi Nnakwo, Nkem Emelike Nwankwo, Ifeanacho Uchenna Okeke
International Journal of Civil and Structural Engineering Research
ISSN 2348-7607 (Online)
Vol. 11, Issue 1, April 2023 - September 2023
Page No: 85-90
Research Publish Journals
Website: www.researchpublish.com
Published Date: 15-September-2023
